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Tei '14 [electronic resource]: Proceedings of the Eighth International Conference on Tangible, Embedded and Embodied Interaction : Munich, Germany, February 16-19, 2014

sponsor, ACM SIGCHI
Format
EBook; Book; Online
Published
New York : ACM, 2013.
Language
English
Variant Title
Tangible, Embedded and Embodied Interaction '14
Proceedings of the 8th International Conference on Tangible, Embedded and Embodied Interaction
TEI '14
Eighth International Conference on Tangible, Embedded, and Embodied Interaction, Munich, Germany - February 16 - 19, 2014
ISBN
9781450326353 (print)
Description
Mode of access: World wide Web.
Copyright Not EvaluatedCopyright Not Evaluated
Technical Details
  • Access in Virgo Classic
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