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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales

Jianfeng Luo, David Dornfeld
Format
Book
Published
Berlin ; [London] : Springer, 2004.
Language
English
ISBN
354022369X (hbk.)
Description
xxiv, 311 p. : ill. ; 25 cm.
Notes
Includes bibliographical references and index.
Technical Details
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    LEADER 01068nam a2200301Ia 4500
    001 u4226647
    003 SIRSI
    005 20050215124107.0
    008 040714s2004 gw a b 001 0 eng d
    015
      
      
    a| GBA458060 2| bnb
    020
      
      
    a| 354022369X (hbk.)
    035
      
      
    a| (Sirsi) o56643103
    035
      
      
    a| (OCoLC)56643103
    040
      
      
    a| UKM c| UKM d| OHX
    042
      
      
    a| ukblsr
    072
      
    7
    a| TK 2| lcco
    090
      
      
    a| TK7874 b| .L86 2004
    100
    1
      
    a| Luo, Jianfeng.
    245
    1
    0
    a| Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : b| from particle scale to feature, die and wafer scales / c| Jianfeng Luo, David Dornfeld.
    260
      
      
    a| Berlin ; a| [London] : b| Springer, c| 2004.
    300
      
      
    a| xxiv, 311 p. : b| ill. ; c| 25 cm.
    504
      
      
    a| Includes bibliographical references and index.
    596
      
      
    a| 5
    650
      
    0
    a| Integrated circuits x| Design and construction.
    650
      
    0
    a| Integrated circuits x| Design and construction x| Simulation methods.
    700
    1
      
    a| Dornfeld, D. A.
    999
      
      
    a| TK7874 .L86 2004 w| LC i| X004811655 l| STACKS m| SCI-ENG t| BOOK
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