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.1-Degree Analysis of Silicon Wafer Orientation Using X-Ray Diffraction Techniques

Barnes, Sheldon
Format
Book
Published
2002.
Language
English
Notes
Mechanical Engineering.
Technical Details
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    a| Barnes, Sheldon
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    a| .1-degree analysis of silicon wafer orientation using x-ray diffraction techniques.
    260
      
      
    c| 2002.
    500
      
      
    a| Mechanical Engineering.
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    a| 14
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    a| ME 200202 w| ALPHANUM i| X004381881 l| BY-REQUEST m| IVY t| THESIS-4TH
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