Item Details

The Importance of Temporal and Spatial Temperature Gradients in IC Reliability Analysis

Huang, Wei; Lu, Zhijian; Ghosh, Shougata; Lach, John; Stan, Mircea; Skadron, Kevin
Format
Report
Author
Huang, Wei
Lu, Zhijian
Ghosh, Shougata
Lach, John
Stan, Mircea
Skadron, Kevin
Abstract
Existing IC reliability models assume a uniform, typically worst-case, operating temperature, but temporal and spatial tem- perature variations affect expected device lifetime. This paper presents a model that accounts for temperature gradients, dra- matically improving interconnect and gate-oxide lifetime pre- diction accuracy. By modeling expected lifetime as a resource that is consumed over time at a temperature-dependent rate, sub- stantial design margin can be reclaimed and/or less expensive cooling systems may be used. This report is superseded by TR CS-2004-08.
Language
English
Date Received
20121029
Published
University of Virginia, Department of Computer Science, 2004
Published Date
2004
Collection
Libra Open Repository
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