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HotSpot 6.0: Validation, Acceleration and Extension

Zhang, Runjie; Stan, Mircea; Skadron, Kevin
Format
Report
Author
Zhang, Runjie
Stan, Mircea
Skadron, Kevin
Abstract
The challenge of removing the heat generated by microprocessors with reasonable cost has long been identified as a critical issue. As a matter of fact, the cooling constraint (a.k.a., thermal wall) has became a major hurdle that limits the scaling of operating frequency and transistor density. As a fast and accurate thermal model, HotSpot enables early-stage evaluation of chip temperature and therefore supports architectural study of dynamic thermal management strategies, chip floorplanning, and novel cooling solutions.
Language
English
Date Received
2015-06-22
Published
University of Virginia, Department of Computer Science, 2015
Published Date
2015
Collection
Libra Open Repository
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