Item Details

HotSpot 6.0: Validation, Acceleration and Extension

Zhang, Runjie; Stan, Mircea; Skadron, Kevin
Format
Report
Author
Zhang, Runjie
Stan, Mircea
Skadron, Kevin
Abstract
The challenge of removing the heat generated by microprocessors with reasonable cost has long been identified as a critical issue. As a matter of fact, the cooling constraint (a.k.a., thermal wall) has became a major hurdle that limits the scaling of operating frequency and transistor density. As a fast and accurate thermal model, HotSpot enables early-stage evaluation of chip temperature and therefore supports architectural study of dynamic thermal management strategies, chip floorplanning, and novel cooling solutions.
Language
English
Date Received
20150622
Published
University of Virginia, Department of Computer Science, 2015
Published Date
2015
Collection
Libra Open Repository
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